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EMI FERRITE
EMI SUPPRESSION FERRITE TILE FOR CPU
( SD Series )
 
- Thermally conductive ferrite plates designed for EMI absorption on ICs, CPUs and bus drives running at high clock speeds.
- Reduced thickness (0.8 mm) (.031") and excellent thermal conductivity characteristics allow the tile to be inserted between CPU and heat sink, providing EMI shielding without affecting the heat dissipation process.
- The ferrite tiles are available in standard (as shown), customized sizes and are optionally supplied with thermally-conductive adhesive transfer tape for convenient fastening.
 
 EMI shielding for any type of integrated circuit that generates radiated emissions within up to 1GHz frequency range.
- Effective noise attenuation and thermal transfer in a compact, space saving, heat sink integrated solution.
 Mechanical Characteristics
 Part Number: SD-28-28-0.8 |
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AC Initial permeability
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650μiac
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Relative loss factor
(tan δ/μiac)
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20 x 10-6@0.1MHz
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Relative temperature factor
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12-20 x 10 6 /  |
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Thermal Conductivity
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1 - 5W/m- |
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Specific resistively
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1 x 108 Ω-cm
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Recommended frequency range
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30MHz - 1 GHz
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Part Numbers
| Part No. |
A
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B
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C
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| SD-28-28-0.8 |
28.0
(1.102)
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28.0
(1.102)
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0.8
(0.031)
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| SD-38-38-2 |
38.0
(1.496)
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38.0
(1.496)
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2.0
(0.078)
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Unit: mm (inch)
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Thermally-Conductive Adhesive Transfer Tape
( Optional)
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The ferrite tile can be optionally provided with thermally-conductive adhesive transfer tape for ambient temperature bonding on ICs, heat sinks, flex circuits, etc.
Product description: Ceramic-filled acrylic pressure sensitive adhesive film supported on a protective release liner, featuring an excellent combination of thermal conductivity, electrical insulation adhesion (with reworkability) and ease of use.
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