| No. |
Part name |
Problems in development and manufacture
|
Solution / Introduced products |
| 1. |
Frame ground
contact to board |
High-frequency noise dulls signals.
Filters cannot be used. |
Main high-frequency noise is a common mode noise. Prepare the frame ground pitch at 1/8 of noise wavelength to lower the noise level, and make the desired signal active.
On-board contact: OG series. |
| 2. |
Connector |
EMI noise from frame grounding of I/0 cable connector |
Install high-shield gasket between connector shell and sheet metal to assure grounding.
High-shield gasket: IMG series. |
| 3. |
Signal cable |
EMI Noise in picture image, communication, and signal cables. |
Mount ferrite core on a cable to cut EMI noise. Split core : FPC series & FPO series. |
| 4. |
Board |
Static electricity. |
Attach EMI absorption sheet MG-02A on back of the board to solve static. EMI absorption sheet: MG series. |
| 5. |
Harness |
Insufficient space at the snap to secure the harness. |
Space-saving clamp: Snap protrusion (stick-out) is reduced.
Separation and disassembly are improved by removable clamp. Removable clamp: RBWS series. |
