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Products / EMC / EMI GROUNDING COMPONENTS / FRAME GROUNDING EDGE SPACER (PART No. FGES-10) ( FGES Series )

EMI GROUNDING COMPONENTS

FRAME GROUNDING EDGE SPACER (PART No. FGES-10) ( FGES Series )



Features

  • Provides simultaneous support and grounding with quick release capability for PC board assemblies where frequent inspection or removal are expected.
  • Light-weight PPE resin base provided with a tinned phosphor bronze conductive strip.
  • High quality materials with excellent flexibility provide constant contact pressure and stable contact resistance under heat variation and heavy vibration conditions.
  • Single piece with snap-on mounting capability - materials and labor saving solution to replace the classical screw assembled metal spacers.


  • Snap-on card edge spacers provide support for printed circuit boards with quick release capability in applications where electrical connection between elements is required for EMI shielding or ESD suppression.
  • Ideal labor saving solution for high volume electronic packaging applications.
  • Compatible for using in combination with various types of hinged card spacers and corner posts (PHD-10 and KGCP-10).

Specifications

  • Material:
    Resin base - Polyphenylene ether
  • Flammability rating - UL94-V0
    Conductive strip:
    Tin plated phosphor bronze
    Thickness: 0.15 mm (0.006 in.)
  • Recommended board/panel thickness:
    Top: 1.6 - 2.0 mm (0.063 - 0.080 in.)
    Bottom: 1.0 - 2.0 mm (0.039 - 0.080 in.)
  • Mounting hole dimensions:
    Top: 4.0 mm (0.157 in.) in diameter
    Bottom (chassis):
    special profile as shown
  • Contact resistance: 0.01 - 0.0001 Ohms

FGS

 

 
Unit: mm (inch)
Part No.
A
B
C
D
E
F
G
H
I
FGES-10 13.0
(0.512)
7.6
(0.299)
1.8
(0.071)
3.6
(0.142)
7.2
(0.283)
7.5
(0.295)
7.1
(0.279)
6.5
(0.256)
10.0
(0.394)

 

*Specifications and dimensions are subject to change without notice for product improvement.



INTERMARK (U.S.A.), INC.
1310 TULLY ROAD
STE. 117
SAN JOSE, CA. 95122
U.S.A.
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