EMI GROUNDING COMPONENTS
FRAME GROUNDING EDGE SPACER (PART No. FGES-10) ( FGES Series )
![Features](../../images/b_Features.gif) ![](images/fges_photo.jpg)
- Provides simultaneous support and grounding with quick release capability for PC board assemblies where frequent inspection or removal are expected.
- Light-weight PPE resin base provided with a tinned phosphor bronze conductive strip.
- High quality materials with excellent flexibility provide constant contact pressure and stable contact resistance under heat variation and heavy vibration conditions.
- Single piece with snap-on mounting capability - materials and labor saving solution to replace the classical screw assembled metal spacers.
![](../../images/b_Application2.gif)
- Snap-on card edge spacers provide support for printed circuit boards with quick release capability in applications where electrical connection between elements is required for EMI shielding or ESD suppression.
- Ideal labor saving solution for high volume electronic packaging applications.
- Compatible for using in combination with various types of hinged card spacers and corner posts (PHD-10 and KGCP-10).
![](../../../common_images/L_e8e8f1.gif)
![Specifications](../../images/b_Specifications.gif)
- Material:
Resin base - Polyphenylene ether
- Flammability rating - UL94-V0
Conductive strip:
Tin plated phosphor bronze
Thickness: 0.15 mm (0.006 in.)
- Recommended board/panel thickness:
Top: 1.6 - 2.0 mm (0.063 - 0.080 in.)
Bottom: 1.0 - 2.0 mm (0.039 - 0.080 in.)
- Mounting hole dimensions:
Top: 4.0 mm (0.157 in.) in diameter
Bottom (chassis):
special profile as shown
- Contact resistance: 0.01 - 0.0001 Ohms
![FGS](images/fges_d.jpg)
|
Unit: mm (inch)
|
Part No. |
A
|
B
|
C
|
D
|
E
|
F
|
G
|
H
|
I
|
FGES-10 |
13.0
(0.512) |
7.6
(0.299) |
1.8
(0.071) |
3.6
(0.142) |
7.2
(0.283) |
7.5
(0.295) |
7.1
(0.279) |
6.5
(0.256) |
10.0
(0.394) |
*Specifications and dimensions are subject to change without notice for product improvement.
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