| No. |
Part name |
Problems in development and manufacture
|
Solution / Introduced products |
| 1. |
Sheet metal unit |
Grounding between case and unit |
IMG Gasket ensures grounding to frame: it offers high-flexibility and low-surface resistance. High shield gasket (IMG) |
| 2. |
Case bottom |
CPU heat transfers to case, causing a thermal problem |
EM Cool sheet makes product cooler and thinner. |
| 3. |
Shielding plate |
Grounding to frame of shielding plates & boards |
OG contact on the board improves grounding, and eliminates the labor to attach a gasket. OG series |
| 4. |
Mother board |
CPU clock acceleration causes high frequency EMI noise.
Erratic operation and safety issues. |
EMI absorption sheets will solve problem. EMI absorption sheet: MG-02A series |
