|
Product Name |
Part No. |
![](images/CPVS_shohin1.jpg) |
COOL PROVIDE
Ultra-low hardness (ASKER C 18)for a silicone free sheet.
|
CPVS |
![](images/CPHS_shohin1.jpg) |
COOL PROVIDE
Ultra-low hardness (ASKER C 23)for a non-silicone sheet
|
CPHS |
![](images/CPV_shohin1.jpg) |
COOL PROVIDE
EPDM-based Thermally Conductive Sheet
Silicone Free - No Siloxane Gas
|
CPV |
![](images/CGD_CGDR_shohin1.jpg) |
CHANGE GEL
50 degrees phase change material secures close contact with heating elements
Easy and clean handling
|
CGD_CGDR |
![](images/CPU_shohin1.jpg) |
CPU PAD
Thermally conductive double-sided adhesive tape Ultrathin type : t = 0.14mm
|
CPU |
![](images/SPVS_shohin1.jpg) |
COOL PROVIDE (5W)
Highly conformable and strong silicone-based material
Thermal conductivity : 5W/m-K
|
SPVS |
![](images/GP1_shohin1.jpg) |
GAP-PAD
Highly conformable and strong thermally conductive silicone sheet with reinforcement layer
Wide range of thickness : 0.5mm to 4.0mm
|
GP1 |
![](images/SP_shohin1.jpg) |
SIL-PAD
Thin thermally conductive sheet :t=0.25mm
Thin but very strong and conformable silicone-based material with fiberglass reinforcement
|
SP |
![](images/HF_shohin1.jpg) |
HI-FLOW 115
65 degrees phase change material secures close contact with heating elements
Easy application - Solid at room temperature
|
HF |